ASME InterPACK2024|24/10/7 (サンノゼ)

Topology Optimization of Electronic Line Using Computer Aided Engineering Software (査読・発表)
Kotaro Miura, Hiromu Kudo, Kazuhiko Sasagawa, Kazuhiro Fujisaki

EFFECT OF PASSIVATION LAYER AND LINE THICKNESS ON DAMAGE MECHANISM OF FLEXIBLE AG NANOWIRE INTERCONNECTS UNDER HIGH DENSITY CURRENT(査読・発表)
Kazuki Hisasue, Kazuhiko Sasagawa, Kazuhiro Fujisaki,Kotaro Miura,Yusuke Souma